US 11,810,907 B2
Pixel structure for displays
Yu-Hsing Chang, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 29, 2021, as Appl. No. 17/243,972.
Claims priority of provisional application 63/142,022, filed on Jan. 27, 2021.
Prior Publication US 2022/0238500 A1, Jul. 28, 2022
Int. Cl. H10K 59/123 (2023.01); H01L 25/16 (2023.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 21/768 (2006.01); H01L 27/12 (2006.01); H01L 33/40 (2010.01); H10K 50/818 (2023.01); H10K 50/856 (2023.01); H10K 59/124 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01)
CPC H01L 25/167 (2013.01) [H01L 21/76802 (2013.01); H01L 21/76885 (2013.01); H01L 27/1248 (2013.01); H01L 27/156 (2013.01); H01L 33/405 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H10K 50/818 (2023.02); H10K 50/856 (2023.02); H10K 59/123 (2023.02); H10K 59/124 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 2102/3026 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) chip comprising a display pixel, wherein the display pixel comprises:
a bottom electrode;
a reflector bordering the bottom electrode;
a light emission device overlying the reflector;
a top electrode overlying the light emission device; and
a coupling structure extending from the bottom electrode, alongside the reflector, to an interface between the light emission device and the reflector to electrically couple the bottom electrode to the light emission device, wherein the coupling structure is localized to a single side of the reflector and recessed into a bottom of the light emission device, such that the light emission device wraps around a top corner of the coupling structure from a sidewall of the coupling structure to a top surface of the coupling structure.