US 11,810,904 B2
Micro light emitting diode structure and manufacturing method thereof and micro light emitting diode device
Yun-Li Li, MiaoLi County (TW)
Assigned to PlayNitride Display Co., Ltd., MiaoLi County (TW)
Filed by PlayNitride Display Co., Ltd., MiaoLi County (TW)
Filed on Oct. 29, 2020, as Appl. No. 17/084,592.
Claims priority of provisional application 62/980,441, filed on Feb. 24, 2020.
Claims priority of application No. 109116346 (TW), filed on May 18, 2020.
Prior Publication US 2021/0265321 A1, Aug. 26, 2021
Int. Cl. H01L 29/205 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/60 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 25/167 (2013.01); H01L 33/60 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A micro light emitting diode structure, comprising:
a temporary substrate;
a plurality of micro light emitting elements disposed on the temporary substrate;
a plurality of light blocking structures disposed on the temporary substrate and arranged alternately with the micro light emitting elements, wherein each of the light blocking structures comprises a light blocking layer and a light shielding layer disposed on the light blocking layer; and
a connection layer, wherein the micro light emitting elements and the light blocking structures are fixed to the temporary substrate by the connection layer,
wherein a reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer,
wherein the reflectivity of the light blocking layer is greater than a reflectivity of the light shielding layer, and the Young's modulus of the light blocking layer is greater than a Young's modulus of the light shielding layer, and
wherein the connection layer comprises a plurality of connection parts separated from each other, the micro light emitting elements and the light blocking layer of each of the light blocking structures are respectively disposed on the connection parts, and the connection parts expose a part of the temporary substrate.