US 11,810,890 B2
Flip-chip bonding apparatus using VCSEL device
Youn Sung Ko, Chungcheongnam-do (KR); and Geunsik Ahn, Seoul (KR)
Assigned to PROTEC CO., LTD., Gyeonggi-do (KR)
Filed by PROTEC CO., LTD., Gyeonggi-do (KR)
Filed on Apr. 22, 2021, as Appl. No. 17/237,078.
Claims priority of application No. 10-2020-0049451 (KR), filed on Apr. 23, 2020.
Prior Publication US 2021/0335748 A1, Oct. 28, 2021
Int. Cl. B23K 3/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 2224/759 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/75981 (2013.01); H01L 2924/3511 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A flip-chip bonding apparatus using a vertical cavity surface emitting laser (VCSEL) device comprising;
a substrate mounting unit on which a substrate with a plurality of semiconductor chips disposed thereon, is mounted, wherein the plurality of semiconductor chips are disposed to be bonded to an upper surface of the substrate;
a laser head having
a plurality of VCSEL arrays and
a head body on which the plurality of VCSEL arrays are installed, wherein the plurality of VCSEL arrays include a plurality of VCSEL devices emitting infrared laser so as to bond the semiconductor chips to the substrate by irradiating infrared laser light to the semiconductor chips on the substrate mounted on the substrate mounting unit;
a head transfer unit configured to transfer the laser head; and
a control unit configured to control an operation of the laser head and the head transfer unit.