CPC H01L 24/29 (2013.01) [H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/49582 (2013.01); H01L 24/05 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/27464 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83091 (2013.01); H01L 2224/83099 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83395 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83951 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/3512 (2013.01)] | 9 Claims |
6. An electrically conductive bonding agent comprising:
a mixture of nickel (Ni) particles containing nano-sized nickel (Ni) and metal particles having a hardness lower than that of nickel (Ni) and having a particle diameter of micro size,
wherein a volume ratio of the metal particles ranges from 50% to 90% of a total volume of the metal particles and the nickel (Ni) particles.
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