US 11,810,863 B2
Sensor
An-Ping Tseng, Taoyuan (TW); Chi-Fu Wu, Taoyuan (TW); Hao-Yu Wu, Taoyuan (TW); Ming-Hung Wu, Taoyuan (TW); Chun-Yang Tai, Taoyuan (TW); and Tsutomu Fukai, Taoyuan (TW)
Assigned to TDK TAIWAN CORP., Taoyuan (TW)
Filed by TDK TAIWAN CORP., Taoyuan (TW)
Filed on Jun. 4, 2019, as Appl. No. 16/430,993.
Claims priority of application No. 201811486727.X (CN), filed on Dec. 6, 2018.
Prior Publication US 2020/0185327 A1, Jun. 11, 2020
Int. Cl. H01L 23/04 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); B81B 7/00 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/5386 (2013.01) [B81B 7/0061 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/04 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 23/642 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48228 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A sensor, comprising:
a substrate having a plate-like shape and comprising a surface, a first insulating layer, a second insulating layer, and an interconnect structure;
a chip embedded in the substrate and electrically connected to the interconnect structure, wherein the first insulating layer and the second insulating layer overlap the chip when viewed in a direction that is perpendicular to the surface, and the chip is located between the first insulating layer and the second insulating layer when viewed in a direction that is parallel to the surface; and
a first sensing element disposed on the surface and electrically connected to the chip through the interconnect structure, wherein the first insulating layer and the second insulating layer at least partially overlap the first sensing element when viewed in the direction that is perpendicular to the surface;
wherein the substrate comprises a hollow through hole filling with air overlapping a portion of the first sensing element in the direction that is perpendicular to the surface to allow the first sensing element to communicate with the external environment, and the first sensing element is exposed from the hollow through hole when viewed in the direction that is perpendicular to the surface;
wherein the hollow through hole comprises a first segment, a second segment, a third segment, and a fourth segment sequentially arranged in the direction that is perpendicular to the surface;
wherein dimensions of the first segment and the second segment are different, the dimension of the second segment is less than the dimensions of the first segment and the third segment, and a dimension of the third segment is greater than a dimension of the fourth segment.