US 11,810,859 B2
Multi-layered adhesion promotion films
Srinivas V. Pietambaram, Chandler, AZ (US); Rahul N. Manepalli, Chandler, AZ (US); Cemil S. Geyik, Gilbert, AZ (US); and Kemal Aygun, Tempe, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Feb. 18, 2020, as Appl. No. 16/793,951.
Prior Publication US 2021/0257309 A1, Aug. 19, 2021
Int. Cl. H01L 23/532 (2006.01); H01L 21/768 (2006.01)
CPC H01L 23/53295 (2013.01) [H01L 21/76832 (2013.01); H01L 21/76834 (2013.01)] 19 Claims
OG exemplary drawing
 
7. A transmission line, comprising:
a first structure comprising a conductive material,
the first structure having at least one surface;
a second structure including a first layer over the at least one surface of the first structure and comprising a first dielectric material having a first dielectric constant,
a second layer over the first layer,
the second layer being compositionally distinct from the first layer and comprising a second dielectric material having a second dielectric constant, and
a third layer over the second layer and comprising a third dielectric material having a third dielectric constant,
wherein the first dielectric constant is greater than the third dielectric constant and the second dielectric constant is less than the third dielectric constant.