US 11,810,855 B2
Electronic component
Bungo Tanaka, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Jun. 10, 2021, as Appl. No. 17/344,208.
Application 17/344,208 is a continuation of application No. 16/556,656, filed on Aug. 30, 2019, granted, now 11,062,992.
Claims priority of application No. 2018-166368 (JP), filed on Sep. 5, 2018; and application No. 2019-073660 (JP), filed on Apr. 8, 2019.
Prior Publication US 2021/0305157 A1, Sep. 30, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/522 (2006.01); H01L 23/525 (2006.01)
CPC H01L 23/5256 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electronic component comprising:
a lower insulating layer;
an upper insulating layer formed on the lower insulating layer;
a first via electrode embedded in the lower insulating layer;
a second via electrode embedded in the lower insulating layer at an interval from the first via electrode;
a fuse layer that is made of a metal thin film, is interposed in a region between the lower insulating layer and the upper insulating layer, and is electrically connected to the first via electrode and the second via electrode;
a first lower wiring layer formed in a region at a lower insulating layer side with respect to the fuse layer and electrically connected to the first via electrode;
a second lower wiring layer formed in the region at the lower insulating layer side with respect to the fuse layer and electrically connected to the second via electrode;
a first upper wiring layer formed on the upper insulating layer and electrically connected to the first lower wiring layer;
a second upper wiring layer formed on the upper insulating layer and electrically connected to the second lower wiring layer;
a first long via electrode penetrating through and embedded in the lower insulating layer and the upper insulating layer and electrically connected to the first lower wiring layer and the first upper wiring layer; and
a second long via electrode penetrating through and embedded in the lower insulating layer and the upper insulating layer and electrically connected to the second lower wiring layer and the second upper wiring layer.