CPC H01L 23/49589 (2013.01) [H01L 21/288 (2013.01); H01L 21/4825 (2013.01); H01L 21/56 (2013.01); H01L 24/05 (2013.01); H01L 28/60 (2013.01)] | 36 Claims |
1. A microelectronic device, comprising:
a die having a connection surface;
a first pillar coupled to the connection surface;
a second pillar coupled to the connection surface;
a first extended head electrically coupled to the first pillar, the first extended head extending past the first pillar in a direction parallel to the connection surface;
a second extended head electrically coupled to the second pillar, the second extended head extending past the second pillar in a direction parallel to the connection surface, wherein:
the first extended head provides a solder bump pad; and
the second extended head provides at least a portion of a first plate of an integrated capacitor of the microelectronic device; and
a second plate of the integrated capacitor, wherein a dielectric layer of the integrated capacitor includes a portion that extends from between the first and second plates to beyond a footprint of the second plate.
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