CPC H01L 23/3735 (2013.01) [H01L 23/3157 (2013.01); H01L 23/49861 (2013.01); H01L 23/5386 (2013.01)] | 13 Claims |
1. An intelligent power module packaging structure, comprising:
an insulated heat dissipation substrate, having a first surface and a second surface opposite to the first surface;
a plurality of power devices, disposed on the first surface;
a control chip, disposed on the first surface, wherein the control chip provides a gate driver function for driving the power devices, a pulse width modulation function for controlling the power devices, and the control chip and the insulated heat dissipation substrate overlap in an orthographic direction;
a lead frame, bonded onto the first surface, wherein the power devices are electrically connected to the control chip and the lead frame; and
an encapsulant, at least encapsulating the power devices, the control chip, and a portion of the lead frame, wherein the second surface is entirely or partially exposed outside the encapsulant, wherein the insulated heat dissipation substrate comprises a top metal layer close to the first surface, the top metal layer and the lead frame are an integrally-formed structure, the top metal layer is directly in contact with the lead frame, and a material of the top metal layer is substantially identical to a material of the lead frame.
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