US 11,810,835 B2
Intelligent power module packaging structure
Hsin-Chang Tsai, Taoyuan (TW); and Ching-Wen Liu, Taoyuan (TW)
Assigned to ACTRON TECHNOLOGY CORPORATION, Taoyuan (TW)
Filed by ACTRON TECHNOLOGY CORPORATION, Taoyuan (TW)
Filed on Oct. 28, 2020, as Appl. No. 17/082,030.
Claims priority of application No. 109129435 (TW), filed on Aug. 28, 2020.
Prior Publication US 2022/0068754 A1, Mar. 3, 2022
Int. Cl. H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 23/3157 (2013.01); H01L 23/49861 (2013.01); H01L 23/5386 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An intelligent power module packaging structure, comprising:
an insulated heat dissipation substrate, having a first surface and a second surface opposite to the first surface;
a plurality of power devices, disposed on the first surface;
a control chip, disposed on the first surface, wherein the control chip provides a gate driver function for driving the power devices, a pulse width modulation function for controlling the power devices, and the control chip and the insulated heat dissipation substrate overlap in an orthographic direction;
a lead frame, bonded onto the first surface, wherein the power devices are electrically connected to the control chip and the lead frame; and
an encapsulant, at least encapsulating the power devices, the control chip, and a portion of the lead frame, wherein the second surface is entirely or partially exposed outside the encapsulant, wherein the insulated heat dissipation substrate comprises a top metal layer close to the first surface, the top metal layer and the lead frame are an integrally-formed structure, the top metal layer is directly in contact with the lead frame, and a material of the top metal layer is substantially identical to a material of the lead frame.