US 11,810,833 B2
Package structure and method and equipment for forming the same
Wensen Hung, Zhubei (TW); Tsung-Yu Chen, Hsinchu (TW); Tsung-Shu Lin, New Taipei (TW); Chen-Hsiang Lao, New Taipei (TW); Wen-Hsin Wei, Hsinchu (TW); and Hsien-Pin Hu, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 12, 2021, as Appl. No. 17/373,250.
Application 17/373,250 is a division of application No. 16/371,769, filed on Apr. 1, 2019, granted, now 11,062,971, issued on Jul. 13, 2021.
Claims priority of provisional application 62/789,853, filed on Jan. 8, 2019.
Prior Publication US 2021/0343619 A1, Nov. 4, 2021
Int. Cl. H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 21/67 (2006.01); H01L 23/40 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4878 (2013.01); H01L 21/4882 (2013.01); H01L 21/563 (2013.01); H01L 21/67092 (2013.01); H01L 23/3185 (2013.01); H01L 23/40 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
an interposer substrate bonded to a package substrate;
a device die bonded to the interposer substrate;
an encapsulant surrounding the device die;
an underfill between the device die and the interposer substrate, wherein the underfill surrounds sidewalls of the interposer substrate;
an adhesive on the package substrate and a surface of the encapsulant opposite the package substrate;
a thermal interface material on a surface of the device die opposite the package substrate; and
a lid over the device die and the package substrate, wherein the lid contacts the adhesive and the thermal interface material, and wherein the adhesive has a thickness between the lid and the encapsulant greater than a thickness of the thermal interface material between the lid and the device die.