US 11,810,832 B2
Heat sink configuration for multi-chip module
Janak Patel, South Burlington, VT (US); Richard Graf, Gray, ME (US); Manish Nayini, Wappingers Falls, NY (US); and Nazmul Habib, Colchester, VT (US)
Assigned to Marvell Asia Pte Ltd, Singapore (SG)
Filed by Marvell Asia Pte, Ltd., Singapore (SG)
Filed on Jun. 28, 2021, as Appl. No. 17/360,571.
Claims priority of provisional application 63/045,668, filed on Jun. 29, 2020.
Prior Publication US 2021/0407879 A1, Dec. 30, 2021
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/367 (2013.01) [H01L 21/4882 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 25/0655 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A multi-chip integrated circuit (IC) apparatus, comprising:
a substrate;
one or more first IC chips mounted on the substrate;
a second IC chip mounted on the substrate;
one or more first heat sinks respectively thermally coupled to the one or more first IC chips, each first heat sink having i) a respective bottom side, and ii) a respective top side opposite the respective bottom side, the respective top side being located further from the substrate in a first direction than the respective bottom side, a particular first heat sink among the one or more first heat sinks including an aperture;
a second heat sink having i) an under side, and ii) a top side opposite the under side, wherein:
the top side of the second heat sink is located further from the substrate in the first direction than the under side of the second heat sink, and
the under side of the second heat sink is located further from the substrate in the first direction than each of the respective one or more top sides of the one or more first heat sinks; and
a heat conducting structure, distinct from the second heat sink, that extends from the second IC chip in the first direction and through the aperture of the particular first heat sink to the under side of the second heat sink to thermally couple the second heat sink to the second IC chip, the heat conducting structure thermally coupled to the second IC chip and thermally coupled to the second heat sink.