US 11,810,830 B2
Chip package structure with cavity in interposer
Shin-Puu Jeng, Hsinchu (TW); Feng-Cheng Hsu, New Taipei (TW); and Shuo-Mao Chen, New Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 26, 2022, as Appl. No. 17/814,874.
Application 17/814,874 is a division of application No. 16/984,382, filed on Aug. 4, 2020, granted, now 11,443,993.
Claims priority of provisional application 62/897,460, filed on Sep. 9, 2019.
Prior Publication US 2022/0359320 A1, Nov. 10, 2022
Int. Cl. H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/13 (2013.01) [H01L 23/49833 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/50 (2013.01); H01L 25/18 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a package substrate;
an interposer substrate disposed over the package substrate, wherein the interposer substrate includes a silicon substrate, and wherein the interposer substrate has a bottom surface facing and adjacent to the package substrate, a top surface opposite the bottom surface, a first cavity formed on the top surface, and a second cavity formed on the bottom surface;
a first semiconductor device disposed on the top surface of the interposer substrate;
a second semiconductor device disposed in the first cavity and electrically connected to the first semiconductor device and/or the interposer substrate; and
a third semiconductor device disposed in the second cavity,
wherein the package substrate has a top surface facing and adjacent to the interposer substrate, and a third cavity is formed on the top surface of the package substrate and aligned with the second cavity of the interposer substrate, wherein the third cavity is configured to accommodate the third semiconductor device.