US 11,810,813 B2
System for designing thermal sensor arrangement
Jaw-Juinn Horng, Hsinchu (TW); and Szu-Lin Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Nov. 17, 2020, as Appl. No. 16/950,381.
Application 16/950,381 is a division of application No. 16/206,699, filed on Nov. 30, 2018, granted, now 10,861,738.
Application 16/206,699 is a division of application No. 14/713,183, filed on May 15, 2015, granted, now 10,163,686, issued on Dec. 25, 2018.
Claims priority of provisional application 62/139,886, filed on Mar. 30, 2015.
Prior Publication US 2021/0090937 A1, Mar. 25, 2021
Int. Cl. H01L 21/765 (2006.01); G01K 7/01 (2006.01); G01R 31/28 (2006.01); G01K 1/16 (2006.01); H01L 21/71 (2006.01); H01L 21/768 (2006.01)
CPC H01L 21/765 (2013.01) [G01K 1/16 (2013.01); G01K 7/01 (2013.01); G01R 31/2874 (2013.01); H01L 21/71 (2013.01); H01L 21/76877 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for designing a temperature sensor arrangement, the system comprising:
a processor; and
a non-transitory computer readable medium connected to the processor, wherein the non-transitory computer readable medium comprises instructions, and the processor is configured to execute the instructions for:
designing a sensor array, wherein the sensor array comprises a first transistor of a first device, and a plurality of second transistors of a second device different from the first device;
designing a guard ring region between the sensor array and another circuit of an integrated circuit, wherein the guard ring region comprises a transistor structure;
designing a thermally conductive element between the sensor array and the guard ring region, wherein the thermally conductive element is connected to the transistor structure, the first transistor and each of the plurality of second transistors; and
generating the temperature sensor arrangement.