CPC H01L 21/6835 (2013.01) [H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01)] | 20 Claims |
1. A method for transferring micro light emitting diodes (micro-LEDs), comprising:
forming a plurality of micro fight emitting diode chips on a base, each of the micro light emitting diode chips having an epitaxial stacked layer connected to the base and an electrode formed on the epitaxial stacked layer opposite to the base, the micro light emitting diode chips being separated from one another by gap regions;
attaching the electrodes of the micro light emitting diode chips to a temporary substrate and removing the base from the micro light emitting diode chips; forming a light shielding layer on the temporary substrate to fill the gap regions so that the micro light emitting diode chips are separated from one another by the light shielding layer;
forming a light-transmissible packaging layer to cover the light shielding layer and the micro light emitting diode chips so as to obtain a plurality of micro-LEDs, each of the micro-LEDs including a corresponding one of the micro light emitting diode chips and a portion of the light-transmissible packaging layer formed on the corresponding one of the micro light emitting diode chips, the micro-LEDs constituting a plurality of pixels, each of the pixels including at least two of the micro-LEDs emitting different colors of light;
removing the temporary substrate to form a light emitting assembly; dividing the light emitting assembly so as to separate the pixels from one another; and
transferring the pixels to a permanent substrate.
|