US 11,810,808 B2
Apparatus and method for facilitating planar delayering of integrated circuit die
Joshua Joseph Trujillo, Belton, MO (US); and Robert Allen Williams, Belton, MO (US)
Assigned to HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC, Kansas City, MO (US)
Filed by HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC, Kansas City, MO (US)
Filed on Oct. 31, 2019, as Appl. No. 16/669,851.
Application 16/669,851 is a division of application No. 16/180,734, filed on Nov. 5, 2018, granted, now 10,573,547.
Prior Publication US 2020/0144091 A1, May 7, 2020
Int. Cl. H01L 21/683 (2006.01); H01L 21/306 (2006.01)
CPC H01L 21/6835 (2013.01) [H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 2221/68313 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An apparatus for removing one or more layers from a die for an integrated circuit, the apparatus comprising:
a pocket created in a sacrificial material, wherein the pocket substantially conforms to a shape of the die such that when the die is inserted into the pocket and prior to the removal of any material, an edge of the die is contiguous with a wall of the pocket and a top surface of the die is coplanar with a top surface of the pocket; and
a adhesive substance positioned in the pocket,
the die inserted into the pocket and against the adhesive substance which adheres to a bottom of the die and aids in retaining the die in the pocket, wherein the one or more layers of the die defining the top surface of the die and one or more layers of the sacrificial material defining the top surface of the pocket and surrounding the die are removed without rounding the edges of the die.