US 11,810,800 B2
Substrate support, test device, and method of adjusting temperature of substrate support
Hiroyuki Nakayama, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Mar. 11, 2021, as Appl. No. 17/198,704.
Claims priority of application No. 2020-046016 (JP), filed on Mar. 17, 2020.
Prior Publication US 2021/0296145 A1, Sep. 23, 2021
Int. Cl. H01L 21/67 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67115 (2013.01) [H01L 21/67109 (2013.01); H01L 21/67316 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate support for placing a substrate, the substrate support comprising:
a top plate portion having a surface on which a substrate is placed;
a light irradiation mechanism that includes a plurality of light-emitting elements, is disposed to face the substrate placed on the top plate portion, and heats the substrate using light emitted from the light-emitting elements;
a channel-forming member that transmits the light emitted from the light-emitting elements and is directly bonded to a rear surface of the top plate portion so as to be interposed between the top plate portion and the light irradiation mechanism, wherein refrigerant channels are formed between the channel-forming member and the top plate portion, a refrigerant, which transmits the light emitted from the light-emitting elements, flows through the refrigerant channels, and the top plate portion and the channel-forming member are made of materials having different thermal expansion coefficients;
a temperature adjustment part configured to adjust a temperature of the channel-forming member;
a cooling unit configured to cool a driving unit for driving the light-emitting elements using a refrigerant; and
a controller configured to control the temperature adjustment part,
wherein the controller controls the temperature adjustment part such that the channel-forming member is at a temperature at which the top plate portion is not warped, and said temperature is calculated based on a temperature of the top plate portion, a temperature of the refrigerant of the refrigerant channel and a temperature of the refrigerant of the cooling unit.