US 11,810,797 B2
Wetting processing apparatus and operation method thereof
Amlan Sen, Singapore (SG); and Navaneetha Kumaran Baheerathan, Singapore (SG)
Assigned to PYXIS CF PTE. LTD., Singapore (SG)
Filed by PYXIS CF PTE. LTD., Singapore (SG)
Filed on Dec. 20, 2019, as Appl. No. 16/722,438.
Claims priority of application No. 10201909599W (SG), filed on Oct. 14, 2019.
Prior Publication US 2021/0111045 A1, Apr. 15, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); C23F 1/08 (2006.01)
CPC H01L 21/67086 (2013.01) [C23F 1/08 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A wet processing apparatus for performing wet processing treatment on a substrate, comprising:
a tank body comprising at least one side wall, the at least one side wall having an outer side and an opening extending from the inside to the outside of the tank body, the tank body being configured to accommodate a wet processing solution;
a substrate mounting plate having an inner side that is fixed to the outer side of, and around the opening of, the at least one side wall of the tank body, a hole positioned in the substrate mounting plate to correspond to a position of the opening in the at least one side wall of the tank body, an outer side opposed to the inner side, and a substrate mounting area on the outer side of the substrate mounting plate arranged around the hole; and
a fixing device comprising
(1) at least one clamping piece arranged on a periphery of the hole of the substrate mounting plate configured to fix the substrate over the hole on the substrate mounting plate and at the opening of the at least one side wall of the tank body, the at least one clamping piece comprises a supporting plate that comprises a receiving slot, and a clamping plate that is inserted into and capable of sliding in the receiving slot, between a retracted position disposed on the substrate mounting area and away from the hole of the substrate mounting plate, and an extended position disposed on the substrate mounting area and near the hole of the substrate mounting plate, and
(2) a second driving mechanism, wherein the second driving mechanism is configured to drive at least one part of the at least one clamping piece along a second direction perpendicular to the outer side of the substrate mounting plate on which the substrate is fixed, so that the at least one part of the at least one clamping piece applies a pressure towards the substrate mounting area.