US 11,810,767 B2
Wafer placement device
Hiroshi Takebayashi, Handa (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Aug. 24, 2020, as Appl. No. 17/000,711.
Application 17/000,711 is a continuation of application No. PCT/JP2019/035436, filed on Sep. 10, 2019.
Claims priority of application No. 2018-171405 (JP), filed on Sep. 13, 2018.
Prior Publication US 2020/0388471 A1, Dec. 10, 2020
Int. Cl. H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32724 (2013.01); H01L 21/67103 (2013.01); H01L 21/6833 (2013.01); H01L 21/68721 (2013.01); H01L 21/68735 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A wafer placement device comprising:
a wafer placement stage including a wafer electrostatic chuck and a wafer cooling plate attached to a surface of the wafer electrostatic chuck on side opposite to a wafer placement surface thereof;
a focus-ring placement stage being separate from the wafer placement stage, arranged around the wafer placement stage, and including a focus-ring electrostatic chuck and a focus-ring cooling plate attached to a surface of the focus-ring electrostatic chuck on side opposite to a focus-ring placement surface thereof; and
a clamping member being separate from the focus-ring placement stage and arranged around the focus-ring placement stage,
wherein the wafer cooling plate includes a wafer cooling plate flange projecting radially outward from an outer peripheral surface of an end portion of the wafer cooling plate on a side closer to a mounting plate onto which the wafer placement device is mounted;
the focus-ring cooling plate includes a pressing portion that presses the wafer cooling plate flange against the mounting plate, and a focus-ring cooling plate flange projecting radially outward from an outer peripheral surface of an end portion of the focus-ring cooling plate on side closer to the mounting plate, and
the clamping member is fastened to the mounting plate with fasteners in a state of pressing the focus-ring cooling plate flange against the mounting plate, thus fixing the wafer placement stage and the focus-ring placement stage to the mounting plate without directly fastening the wafer placement stage and the focus-ring placement stage to the mounting plate.