US 11,810,723 B2
Ceramic electronic component
Masahiro Mori, Xiamen (CN); Akihiro Masuda, Tokyo (JP); Shinya Ito, Tokyo (JP); and Norihisa Ando, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP); and TDK XIAMEN CO., LTD., Xiamen (CN)
Filed by TDK CORPORATION, Tokyo (JP); and TDK XIAMEN CO., LTD., Fujian (CN)
Filed on Oct. 6, 2021, as Appl. No. 17/495,274.
Claims priority of application No. 202011244620.1 (CN), filed on Nov. 10, 2020.
Prior Publication US 2022/0148808 A1, May 12, 2022
Int. Cl. H01G 4/232 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface;
an end-face electrode formed on the end surface of the ceramic element body; and
a lead terminal connected to the end-face electrode by soldering, wherein
the lead terminal comprises:
an adjacent part overlapping the end-face electrode in a side view from the second axis; and
an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface,
a first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and
the first recess exists at a position close to the end of the adjacent part.