US 11,809,667 B2
Transparent conductive substrate structure used for thermoforming process
Sheng-Chieh Tsai, Taoyuan (TW); Yao-Zong Chen, Taoyuan (TW); Yu-Yang Chang, Taoyuan (TW); and Hsiou-Ming Liu, Taoyuan (TW)
Assigned to NANOBIT TECH. CO., LTD., Taoyuan (TW)
Filed by NANOBIT TECH. CO., LTD., Taoyuan (TW)
Filed on Jun. 4, 2021, as Appl. No. 17/339,796.
Claims priority of application No. 110115645 (TW), filed on Apr. 29, 2021.
Prior Publication US 2022/0350443 A1, Nov. 3, 2022
Int. Cl. G06F 3/044 (2006.01); B29C 51/00 (2006.01); B29C 51/14 (2006.01); B29L 31/34 (2006.01)
CPC G06F 3/0445 (2019.05) [B29C 51/002 (2013.01); B29C 51/14 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0006 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3475 (2013.01); G06F 2203/04103 (2013.01)] 43 Claims
OG exemplary drawing
 
1. A transparent conductive substrate structure used for a thermoforming process, and the transparent conductive substrate structure comprising:
a transparent cover plate comprising a toughening layer on one side or two sides of a surface of the transparent cover plate, and
a touch sensing layer structure arranged on one surface of the toughening layer, and the touch sensing layer structure comprising:
a first transparent conductive layer directly arranged on the toughening layer, and a first wiring area arranged on one side of a surface of the first transparent conductive layer, and a first electrode wire layer arranged on a surface of the first wiring area, and
a buffer protective layer arranged on the other surface of the first transparent conductive layer,
wherein, a thickness of the toughening layer is less than or equal to 3 μm, and a surface of the toughening layer is treated with plasma to increase adhesion between the toughening layer and the first transparent conductive layer.