CPC G06F 16/258 (2019.01) [G06F 16/176 (2019.01); G06F 16/26 (2019.01); G06F 16/288 (2019.01); H01L 21/683 (2013.01); H01L 21/68714 (2013.01); H01L 21/68728 (2013.01); H01L 22/30 (2013.01)] | 19 Claims |
1. A wafer-level package handling system, comprising:
a chuck assembly defining an upper surface configured to support a wafer-level package assembly;
a clamping mechanism securing the wafer-level package assembly to the upper surface, wherein the clamping mechanism includes a cover having a central aperture that exposes a top surface of the wafer-level package assembly, and a latch mechanism extending around a side edge of the chuck assembly to apply pressure from a lower surface of the chuck assembly in order to secure the wafer-level package assembly to the chuck assembly.
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