US 11,809,441 B2
Wafer-level package assembly handling
Kevin Barr, Bloomington, MN (US); and Edward Andrew Condon, Sandown, NH (US)
Assigned to Onto Innovation Inc., Wilmington, MA (US)
Appl. No. 16/651,870
Filed by Onto Innovation, Inc., Wilmington, DE (US)
PCT Filed Sep. 28, 2018, PCT No. PCT/US2018/053300
§ 371(c)(1), (2) Date Mar. 27, 2020,
PCT Pub. No. WO2019/067834, PCT Pub. Date Apr. 4, 2019.
Claims priority of provisional application 62/564,400, filed on Sep. 28, 2017.
Prior Publication US 2020/0257699 A1, Aug. 13, 2020
Prior Publication US 2022/0012261 A2, Jan. 13, 2022
Prior Publication US 2022/0121676 A2, Apr. 21, 2022
Int. Cl. G06F 16/25 (2019.01); G06F 16/26 (2019.01); G06F 16/176 (2019.01); G06F 16/28 (2019.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01)
CPC G06F 16/258 (2019.01) [G06F 16/176 (2019.01); G06F 16/26 (2019.01); G06F 16/288 (2019.01); H01L 21/683 (2013.01); H01L 21/68714 (2013.01); H01L 21/68728 (2013.01); H01L 22/30 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A wafer-level package handling system, comprising:
a chuck assembly defining an upper surface configured to support a wafer-level package assembly;
a clamping mechanism securing the wafer-level package assembly to the upper surface, wherein the clamping mechanism includes a cover having a central aperture that exposes a top surface of the wafer-level package assembly, and a latch mechanism extending around a side edge of the chuck assembly to apply pressure from a lower surface of the chuck assembly in order to secure the wafer-level package assembly to the chuck assembly.