US 11,809,088 B2
Method for controlling a lithographic apparatus
Hadi Yagubizade, Eindhoven (NL); Min-Seok Kim, Hwaseong (KR); Yingchao Cui, Eindhoven (NL); Daan Maurits Slotboom, Wolphaartsdijk (NL); Jeonghyun Park, Eindhoven (NL); and Jeroen Cottaar, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/636,452
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed Jul. 22, 2020, PCT No. PCT/EP2020/070701
§ 371(c)(1), (2) Date Feb. 18, 2022,
PCT Pub. No. WO2021/032398, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 19193151 (EP), filed on Aug. 22, 2019; and application No. 20151440 (EP), filed on Jan. 13, 2020.
Prior Publication US 2022/0334500 A1, Oct. 20, 2022
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01)
CPC G03F 7/70483 (2013.01) 20 Claims
OG exemplary drawing
 
1. A method of determining a control setting for a lithographic apparatus, the method comprising:
obtaining a first correction for a current layer on a current substrate based on first metrology data associated with one or more previous substrates;
obtaining a second correction for the current layer on the current substrate based on a residual determined based on second metrology data associated with a previous layer on the current substrate; and
determining, by a hardware computer system, the control setting for the lithographic apparatus for patterning the current layer on the current substrate by combining the first correction and the second correction.