US 11,809,087 B2
Semiconductor processing tool and methods of operation
Kai-Chieh Chang, Changhua (TW); Kai-Fa Ho, New Taipei (TW); Li-Jui Chen, Hsinchu (TW); and Heng-Hsin Liu, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 27, 2021, as Appl. No. 17/446,252.
Claims priority of provisional application 63/201,461, filed on Apr. 30, 2021.
Prior Publication US 2022/0350259 A1, Nov. 3, 2022
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01)
CPC G03F 7/70358 (2013.01) [G03F 7/70433 (2013.01); G03F 7/70525 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
generating, by a scanner control system, an exposure recipe for performing an exposure operation for a semiconductor substrate,
wherein the exposure recipe includes information identifying:
a plurality of die exposure fields, on the semiconductor substrate, that are to be exposed in the exposure operation,
a plurality of non-exposure fields, on the semiconductor substrate, for which exposure is to be skipped in the exposure operation, and
a scanner route for traversing across the plurality of die exposure fields and a first non-exposure field of the plurality of non-exposure fields,
wherein a second non-exposure field of the plurality of non-exposure fields is omitted from the scanner route; and
providing, by the scanner control system, an input to a substrate stage of an exposure tool to cause the substrate stage to step the semiconductor substrate along the scanner route in the exposure operation.