US 11,809,000 B2
Photonic integrated circuit and package structure
Tsung-Yuan Yu, Taipei (TW); Hung-Yi Kuo, Taipei (TW); Cheng-Chieh Hsieh, Tainan (TW); Hao-Yi Tsai, Hsinchu (TW); Chung-Ming Weng, Hsinchu (TW); Hua-Kuei Lin, Hsinchu (TW); and Che-Hsiang Hsu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 19, 2021, as Appl. No. 17/206,130.
Prior Publication US 2022/0299719 A1, Sep. 22, 2022
Int. Cl. G02B 6/12 (2006.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/4251 (2013.01) [G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); H01L 25/167 (2013.01); G02B 6/12 (2013.01); G02B 2006/121 (2013.01); G02B 2006/12061 (2013.01); H01L 23/562 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A photonic integrated circuit, comprising:
a substrate comprising a top layer made of a semiconductor material;
an interconnection layer over the substrate, wherein the interconnection layer comprises a seal ring structure and an interconnection structure surrounded by the seal ring structure, the seal ring structure has at least one recess from a top view, the recess concaves towards the interconnection structure, and the seal ring structure is a continuous structure from the top view; and
a plurality of silicon waveguides embedded in the top layer of the substrate.