CPC G01R 1/07378 (2013.01) [G01R 1/06772 (2013.01); G01R 1/07328 (2013.01); G01R 1/07357 (2013.01); G01R 1/07371 (2013.01)] | 25 Claims |
1. A testing head configured to verify the operation of a device under test integrated on a semiconductor wafer, the testing head comprising:
a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and
at least one guide provided with a plurality of guide holes configured to house the contact elements,
wherein the at least one guide includes:
a first conductive portion that includes and electrically connects a first group of guide holes, of the plurality of guide holes, to each other and is configured to contact corresponding first contact elements, of the plurality of contact elements, configured to carry a first type of signal; and
a second conductive portion that includes and electrically connects the holes of a second group of the guide holes to each other, the second group housing second contact elements of the plurality of contact elements, the second contact elements being configured to carry a second type of signal, the first and second types of signals chosen between ground signals and power signals,
and wherein the contact elements are pogo pins having a body that includes:
a casing defining a first surface and a second surface, at least one of the first surface and second surface being configured to abut onto the at least one guide; and
an elastic member, arranged in the casing, having a first end connected to the first end portion of the contact element and a second end connected to the second end portion of the contact element.
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