US 11,808,787 B2
Probe card testing device
Tzyy-Jang Tseng, Taoyuan (TW); John Hon-Shing Lau, Taoyuan (TW); Kuo Ching Tien, Chiayi (TW); and Ra-Min Tain, Hsinchu County (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Jun. 9, 2021, as Appl. No. 17/342,550.
Application 17/342,550 is a continuation in part of application No. 17/191,559, filed on Mar. 3, 2021, granted, now 11,540,396.
Claims priority of provisional application 63/071,369, filed on Aug. 28, 2020.
Claims priority of application No. 110101060 (TW), filed on Jan. 12, 2021.
Prior Publication US 2022/0065897 A1, Mar. 3, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); G01R 1/06 (2006.01); G01R 1/07 (2006.01); G01R 1/073 (2006.01); H05K 1/11 (2006.01)
CPC G01R 1/07342 (2013.01) [G01R 1/07328 (2013.01); H05K 1/112 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A probe card testing device, comprising:
a first sub-circuit board;
a second sub-circuit board disposed on one side of the first sub-circuit board;
a connecting structure layer disposed between the first sub-circuit board and the second sub-circuit board, wherein the first sub-circuit board is electrically connected to the second sub-circuit board by the connecting structure layer;
a fixing plate disposed on the second sub-circuit board and comprising an opening and an accommodating groove, wherein the opening penetrates the fixing plate and exposes a plurality of pads on the second sub-circuit board, and the accommodating groove is located on a side of the fixing plate relatively far away from the second sub-circuit board and communicates with the opening;
a probe head disposed in the accommodating groove of the fixing plate; and
a plurality of conductive probes set on the probe head and located in the opening of the fixing plate, wherein one end of the plurality of the conductive probes respectively is in contact with corresponding pads.