CPC G01L 1/16 (2013.01) [G01L 1/18 (2013.01); G01L 5/0028 (2013.01); B81B 3/0072 (2013.01)] | 30 Claims |
1. A microelectromechanical (“MEMS”) force sensor, comprising:
one or more dielectric layers over a sensor die;
a sensing element on a dielectric layer in the one or more dielectric layers, the sensing element operable to convert a change in an electrical characteristic into an analog electrical signal based on an amount of force applied to the MEMS force sensor; and
a conductive contact over at least a portion of, and in electrical contact with, the sensing element.
|