US 11,807,953 B2
Electroplating device and electroplating system
Daiqiong (Diana) Zhang, Shanghai (CN); Chunyan (Cherie) Zhou, Shanghai (CN); Dongqing (Gates) Peng, Suzhou (CN); Yuelin (Kevin) Liang, Shanghai (CN); and Zhongxi Huang, Shanghai (CN)
Assigned to Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN); and Tyco Electronics (Suzhou) Ltd., Suzhou (CN)
Filed by Tyco Electronics (Shanghai) Co., Ltd., Shanghai (CN); and Tyco Electronics (Suzhou) Ltd., Suzhou (CN)
Filed on Jan. 29, 2022, as Appl. No. 17/588,243.
Claims priority of application No. 202110132818.9 (CN), filed on Jan. 29, 2021.
Prior Publication US 2022/0243350 A1, Aug. 4, 2022
Int. Cl. C25D 3/56 (2006.01); C25D 5/18 (2006.01); C25D 17/10 (2006.01)
CPC C25D 3/56 (2013.01) [C25D 5/18 (2013.01); C25D 17/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electroplating device adapted to electroplate an alloy comprising a plurality of metals on a workpiece, the electroplating device comprising:
an electroplating bath containing an electroplating solution in which the workpiece acting as a cathode is at least partially immersed;
a plurality of groups of anodes including a first anode group and a second anode group, each group providing at least one metal required for electroplating, an electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes;
a power supply device adjusting the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy; and
two partition walls separating the electroplating bath into an outer containing part and an inner containing part located inside the outer containing part, the first anode group is arranged in the inner containing part, the second anode group is arranged in the outer containing part, the partition walls are provided with through holes to allow the electroplating solution in the outer containing part to flow into the inner containing part through the through holes.