US 11,807,940 B2
Plated steel material
Takuya Mitsunobu, Tokyo (JP); Takehiro Takahashi, Tokyo (JP); and Jun Maki, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 17/789,753
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Feb. 27, 2020, PCT No. PCT/JP2020/008148
§ 371(c)(1), (2) Date Jun. 28, 2022,
PCT Pub. No. WO2021/171514, PCT Pub. Date Sep. 2, 2021.
Prior Publication US 2023/0193443 A1, Jun. 22, 2023
Int. Cl. C23C 2/06 (2006.01); C23C 2/28 (2006.01); C23C 2/12 (2006.01); C23C 30/00 (2006.01); C22C 18/04 (2006.01); C22C 21/08 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C22C 18/00 (2006.01); C22C 21/00 (2006.01); C22C 21/10 (2006.01); C22C 30/00 (2006.01); C22C 30/06 (2006.01); C23C 2/40 (2006.01); C23C 2/02 (2006.01); C23C 2/26 (2006.01); B21D 22/20 (2006.01); C22C 38/58 (2006.01); C22C 38/00 (2006.01); C22C 38/06 (2006.01); C21D 1/18 (2006.01); C21D 9/00 (2006.01)
CPC C23C 2/06 (2013.01) [B21D 22/20 (2013.01); B32B 15/01 (2013.01); B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C22C 21/00 (2013.01); C22C 21/08 (2013.01); C22C 21/10 (2013.01); C22C 30/00 (2013.01); C22C 30/06 (2013.01); C23C 2/02 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 2/40 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C21D 1/18 (2013.01); C21D 9/00 (2013.01); C22C 38/00 (2013.01); C22C 38/06 (2013.01); C22C 38/58 (2013.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/26 (2015.01)] 8 Claims
OG exemplary drawing
 
1. A plated steel material comprising a steel base material and a plating layer on a surface of the steel base material, wherein the plating layer has a chemical composition comprising, by mass %,
Al: 25.00 to 75.00%,
Mg: 7.00 to 20.00%,
Si: 0.10 to 5.00%,
Ca: 0.05 to 5.00%,
Sb: 0 to 0.50%,
Pb: 0 to 0.50%,
Cu: 0 to 1.00%,
Sn: 0 to 1.00%,
Ti: 0 to 1.00%,
Sr: 0 to 0.50%,
Cr: 0 to 1.00%,
Ni: 0 to 1.00%,
Mn: 0 to 1.00%, and
balance: Zn and impurities, and
in a surface structure of the plating layer, there is, by area ratio, 2.0% or more of an acicular Al—Zn—Si—Ca phase.