US 11,807,926 B2
Copper alloy sliding material
Yuhei Ebata, Toyota (JP)
Assigned to TAIHO KOGYO CO., LTD., Toyota (JP)
Appl. No. 17/639,095
Filed by TAIHO KOGYO CO., LTD., Toyota (JP)
PCT Filed Oct. 14, 2020, PCT No. PCT/JP2020/038714
§ 371(c)(1), (2) Date Feb. 28, 2022,
PCT Pub. No. WO2021/075447, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-189103 (JP), filed on Oct. 16, 2019.
Prior Publication US 2022/0298603 A1, Sep. 22, 2022
Int. Cl. C22C 9/02 (2006.01); C22C 12/00 (2006.01); B22F 1/00 (2022.01)
CPC C22C 9/02 (2013.01) [B22F 1/00 (2013.01); C22C 12/00 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A copper alloy sliding material comprising 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities,
wherein the inorganic compound includes a first inorganic compound which has an average particle size of 0.5 to 3.0 μm and a second inorganic compound which has an average particle size of 4.0 to 20.0 μm and is different from the first inorganic compound, and
wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0; and
wherein the Vickers hardness of each of the first inorganic compound and the second inorganic compound is greater than 1100.