US 11,807,920 B2
Methods of forming cutting elements and supporting substrates for cutting elements
Wanjun Cao, The Woodlands, TX (US); and Marc W. Bird, Houston, TX (US)
Assigned to Baker Hughes Holdings LLC, Houston, TX (US)
Filed by Baker Hughes Holdings LLC, Houston, TX (US)
Filed on May 10, 2022, as Appl. No. 17/662,807.
Application 17/662,807 is a division of application No. 15/842,530, filed on Dec. 14, 2017, granted, now 11,396,688.
Application 15/842,530 is a continuation in part of application No. 15/594,174, filed on May 12, 2017, granted, now 11,292,750, issued on Apr. 5, 2022.
Prior Publication US 2022/0275486 A1, Sep. 1, 2022
Int. Cl. C22C 29/08 (2006.01); E21B 10/567 (2006.01); E21B 10/573 (2006.01); B22F 3/15 (2006.01); C22C 29/00 (2006.01); B22F 7/06 (2006.01); C22C 29/06 (2006.01); E21B 10/55 (2006.01); B22F 5/00 (2006.01); C22C 26/00 (2006.01); B24D 18/00 (2006.01)
CPC C22C 29/08 (2013.01) [B22F 3/15 (2013.01); B22F 7/06 (2013.01); B24D 18/0009 (2013.01); C22C 29/005 (2013.01); C22C 29/067 (2013.01); E21B 10/5673 (2013.01); E21B 10/5735 (2013.01); B22F 2005/001 (2013.01); B22F 2998/10 (2013.01); C22C 26/00 (2013.01); E21B 10/55 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a supporting substrate for a cutting element, comprising:
forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Be, Ga, Ge, and Sn, and one or more of C and W; and
subjecting the precursor composition to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Be, Ga, Ge, and Sn.