	US 11,807,792 B2
	Semiconductor processing liquid and method for processing substrate
Takahiro Eto, Kawasaki (JP); and Lihong Liu, Hillsboro, OR (US)
Assigned to Tokyo Ohka Kogyo Co., Ltd., Kawasaki (JP)
Filed by TOKYO OHKA KOGYO CO., LTD., Kawasaki (JP)
Filed on Feb. 22, 2021, as Appl. No. 17/181,352.
Claims priority of provisional application 62/991,590, filed on Mar. 19, 2020.
Prior Publication US 2021/0324271 A1, Oct. 21, 2021
Int. Cl. C09K 13/04 (2006.01); H01L 21/306 (2006.01); C09K 13/06 (2006.01); H01L 21/3213 (2006.01); C09K 13/08 (2006.01); H01L 21/311 (2006.01)

CPC C09K 13/04 (2013.01) [C09K 13/06 (2013.01); C09K 13/08 (2013.01); H01L 21/30604 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01)]

5 Claims

1. A semiconductor processing liquid comprising:

hydrofluoric acid; and

an organic solvent,

wherein the organic solvent contains dipropylene glycol methyl ether acetate, a content of the organic solvent is 70% by mass or more of the entire semiconductor processing liquid, and

wherein the semiconductor processing liquid has a pH of 1.2 or less.