US 11,807,770 B2
Thin film coating packaging for device having meltable and wetting links
Yuriy Borisovich Matus, Pleasanton, CA (US); Martin G. Pineda, Fremont, CA (US); Boris Golubovic, Chicago, IL (US); and Deepak Nayar, Chicago, IL (US)
Assigned to Littelfuse, Inc., Chicago, IL (US)
Filed by Littelfuse, Inc., Chicago, IL (US)
Filed on May 27, 2021, as Appl. No. 17/331,808.
Claims priority of provisional application 63/039,177, filed on Jun. 15, 2020.
Prior Publication US 2021/0388230 A1, Dec. 16, 2021
Int. Cl. B05D 5/12 (2006.01); C09D 175/04 (2006.01); C09D 177/00 (2006.01); H01H 85/143 (2006.01); B05D 1/00 (2006.01); B05D 1/18 (2006.01); B05D 1/30 (2006.01)
CPC C09D 175/04 (2013.01) [B05D 5/12 (2013.01); C09D 177/00 (2013.01); H01H 85/143 (2013.01); B05D 1/005 (2013.01); B05D 1/18 (2013.01); B05D 1/30 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for creating a thin-film coating, comprising:
mixing an insoluble polymer and a soluble polymer in solid form;
creating a melt mixture of the insoluble polymer and the soluble polymer by heating and mixing the insoluble polymer and the soluble polymer;
exposing the melt mixture to a solvent to create a slurry; and
depositing the slurry on a device to create the thin-film coating.