US 11,807,710 B2
UV-curable resins used for chemical mechanical polishing pads
Chen-Chih Tsai, Naperville, IL (US); Eric S. Moyer, Aurora, IL (US); and Ping Huang, Naperville, IL (US)
Assigned to CMC Materials, Inc., Aurora, IL (US)
Filed by CMC Materials, Inc., Aurora, IL (US)
Filed on Oct. 18, 2021, as Appl. No. 17/503,422.
Claims priority of provisional application 63/093,543, filed on Oct. 19, 2020.
Prior Publication US 2022/0119586 A1, Apr. 21, 2022
Int. Cl. C08G 18/81 (2006.01); C08F 2/48 (2006.01); C08G 18/67 (2006.01); C08K 3/04 (2006.01); C08G 18/10 (2006.01); B24B 37/24 (2012.01)
CPC C08G 18/8116 (2013.01) [B24B 37/24 (2013.01); C08F 2/48 (2013.01); C08G 18/10 (2013.01); C08G 18/6725 (2013.01); C08K 3/04 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A UV-curable resin for forming a chemical-mechanical polishing pad comprising:
(a) an acrylate blocked isocyanate component, wherein the acrylate blocked isocyanate component comprises an acrylate blocking agent and an isocyanate terminated urethane prepolymer, wherein the acrylate blocking agents are selected from 2-hydroxyethyl acrylate (HEA), 2-hydroxyethyl methacrylate (HEMA), 2-(tert-butylamino) ethyl methacrylate (TBEMA), and 3-(acryloyloxy)-2-hydroxypropyl methacrylate (AHPMA), wherein the acrylate blocking agent and the isocyanate terminated urethane prepolymer form a capped prepolymer, and wherein there is a ratio of particular capped prepolymers in the acrylate blocked isocyanate component;
(b) one or more acrylate monomers; and
(c) a photoinitiator.