CPC B81C 1/00896 (2013.01) [B81B 7/0067 (2013.01); B81C 1/00317 (2013.01); G02B 27/0006 (2013.01); B81B 2201/042 (2013.01); B81C 2203/019 (2013.01); G02B 26/0833 (2013.01)] | 20 Claims |
1. A device assembly comprising:
a substrate;
a device on the substrate, the device having an edge;
bond wires electrically coupling the device to the substrate;
an encapsulant barrier contacting the substrate; and
encapsulant contacting the substrate, contacting the edge of the device, and on the bond wires, a portion of the encapsulant contacting the substrate between the encapsulant barrier and the edge of the device and the encapsulant barrier between the portion of the encapsulant contacting the substrate and an edge of the substrate.
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