US 11,807,522 B2
Encapsulant barrier
Jane Qian Liu, Plano, TX (US); Gary Philip Thomson, Rowlett, TX (US); and Richard Allen Richter, McKinney, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jul. 13, 2020, as Appl. No. 16/927,648.
Application 16/927,648 is a continuation of application No. 15/811,562, filed on Nov. 13, 2017, granted, now 10,710,875.
Prior Publication US 2020/0339416 A1, Oct. 29, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 7/18 (2021.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); G02B 27/00 (2006.01); G02B 26/08 (2006.01)
CPC B81C 1/00896 (2013.01) [B81B 7/0067 (2013.01); B81C 1/00317 (2013.01); G02B 27/0006 (2013.01); B81B 2201/042 (2013.01); B81C 2203/019 (2013.01); G02B 26/0833 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device assembly comprising:
a substrate;
a device on the substrate, the device having an edge;
bond wires electrically coupling the device to the substrate;
an encapsulant barrier contacting the substrate; and
encapsulant contacting the substrate, contacting the edge of the device, and on the bond wires, a portion of the encapsulant contacting the substrate between the encapsulant barrier and the edge of the device and the encapsulant barrier between the portion of the encapsulant contacting the substrate and an edge of the substrate.