US 11,807,521 B2
Support structure for MEMS device with particle filter
Chun-Wen Cheng, Zhubei (TW); Chia-Hua Chu, Zhubei (TW); and Wen Cheng Kuo, Changhua County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Mar. 31, 2021, as Appl. No. 17/218,358.
Application 17/218,358 is a continuation of application No. 16/542,489, filed on Aug. 16, 2019, granted, now 10,968,097.
Prior Publication US 2021/0238030 A1, Aug. 5, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B81C 1/00 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01)
CPC B81C 1/00158 (2013.01) [B81B 3/0021 (2013.01); B81B 7/0029 (2013.01); B81C 1/0023 (2013.01); B81C 1/00325 (2013.01); B81C 1/00357 (2013.01); B81C 1/00476 (2013.01); B81C 1/00539 (2013.01); B81C 1/00825 (2013.01); B81C 3/001 (2013.01); B81B 7/0006 (2013.01); B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/115 (2013.01); H01L 23/053 (2013.01); H01L 24/48 (2013.01); H01L 2224/48195 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming a microelectromechanical systems (MEMS) device, the method comprising:
forming a filter stack over a carrier substrate, wherein the filter stack comprises a particle filter layer having a particle filter;
forming a support structure layer over the filter stack;
performing a patterning process on the support structure layer to define a support structure in the support structure layer such that the support structure has one or more segments; and
bonding the support structure to a MEMS structure, wherein the MEMS structure comprises a movable element.