an integrated circuit die having a first surface;

electrically conductive pillars extending perpendicularly from the first surface of the integrated circuit die to a first exterior surface of the multi-die package to enforce a structural offset of the integrated circuit die from the first exterior surface;

a microelectromechanical system (MEMS) die mounted to the integrated circuit die;

at least one metallic structure electrically-coupling the MEMS die and the integrated circuit die; and

encapsulation material disposed between and in contact with the electrically conductive pillars and encapsulating the MEMS die;

wherein the first integrated circuit die further comprises circuitry to sense a temperature of the MEMS die and to adjust an electrical output of the MEMS die in dependence on sensed temperature;

wherein the first surface and the MEMS die are mounted in a manner directly coupled by a thermally-conductive material, so as to place the circuitry to sense the temperature and a MEMS structure with a movable element in thermal communication with one another; and

wherein the MEMS die comprises a crystal silicon resonator having a first longitudinal beam and a second longitudinal beam which are structurally interconnected, the first longitudinal beam being non-co-axial with the second longitudinal beam.