US 11,807,022 B2
Hybrid wet on wet printing methods
Muslim Contractor, Mason, OH (US); Stephen Buchanan, Mason, OH (US); and Stephen Cummings, Mason, OH (US)
Assigned to Kao Corporation, Tokyo (JP)
Appl. No. 17/267,702
Filed by Kao Corporation, Tokyo (JP)
PCT Filed Sep. 4, 2019, PCT No. PCT/US2019/049509
§ 371(c)(1), (2) Date Feb. 10, 2021,
PCT Pub. No. WO2020/072166, PCT Pub. Date Apr. 9, 2020.
Claims priority of provisional application 62/727,062, filed on Sep. 5, 2018.
Prior Publication US 2022/0111673 A1, Apr. 14, 2022
Int. Cl. B41M 3/00 (2006.01); B41M 7/00 (2006.01); B41M 1/18 (2006.01); B41M 5/50 (2006.01); C09D 11/101 (2014.01); B41M 5/00 (2006.01); B41J 11/00 (2006.01)
CPC B41M 3/008 (2013.01) [B41J 11/002 (2013.01); B41M 1/18 (2013.01); B41M 5/0017 (2013.01); B41M 5/50 (2013.01); B41M 7/0045 (2013.01); B41M 7/0081 (2013.01); C09D 11/101 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming an image on a substrate, comprising:
applying a radiation curable analog ink composition by an analog printing method onto a surface of the substrate to form a coated substrate;
applying a radiation curable inkjet ink composition by a digital printing method onto the coated substrate while the radiation curable analog ink composition is still wet to form a hybrid coated substrate; and
exposing the hybrid coated substrate to electron beam radiation to at least partially cure the radiation curable analog ink composition and the radiation curable inkjet ink composition
wherein the radiation curable inkjet ink composition has a surface tension that is lower than a surface tension of the radiation curable analog ink composition.