US 11,807,005 B2
Nozzle arrangements
Galen Cook, Corvallis, OR (US); Garrett E. Clark, Corvallis, OR (US); Michael W. Cumbie, Corvallis, OR (US); James R. Przybyla, Corvallis, OR (US); Richard Seaver, Corvallis, OR (US); Frank D. Derryberry, Corvallis, OR (US); and Si-Lam J. Choy, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Mar. 28, 2023, as Appl. No. 18/127,619.
Application 18/127,619 is a continuation of application No. 17/303,656, filed on Jun. 3, 2021.
Application 17/303,656 is a continuation of application No. 16/605,961, granted, now 11,034,151, issued on Jun. 15, 2021, previously published as PCT/US2018/022026, filed on Mar. 12, 2018.
Prior Publication US 2023/0234355 A1, Jul. 27, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/14 (2006.01); B41J 2/145 (2006.01)
CPC B41J 2/145 (2013.01) [B41J 2/14 (2013.01); B41J 2002/14459 (2013.01); B41J 2202/12 (2013.01); B41J 2202/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A fluid ejection die comprising:
a plurality of nozzles arranged in a plurality of rows along a die length and in a plurality of columns along a die width,
wherein the plurality of nozzles comprises a first pair of sequential columnar nozzles in a first column of the plurality of columns and a second pair of sequential columnar nozzles in the first column;
wherein nozzles in the first pair of sequential columnar nozzles are separated by a first distance along the die length;
wherein the nozzles in the second pair of sequential columnar nozzles are separated by a second distance along the die length; and
wherein the second distance is greater than the first distance.