US 11,806,901 B2
Template, template manufacturing method, and semiconductor device manufacturing method
Kazuhiro Takahata, Yokohama Kanagawa (JP); Toshiaki Komukai, Kawasaki Kanagawa (JP); and Hideki Kanai, Yokohama Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Mar. 12, 2021, as Appl. No. 17/199,967.
Claims priority of application No. 2020-156421 (JP), filed on Sep. 17, 2020.
Prior Publication US 2022/0080627 A1, Mar. 17, 2022
Int. Cl. H01L 21/768 (2006.01); H01L 21/56 (2006.01); B29C 33/42 (2006.01); G03F 7/00 (2006.01)
CPC B29C 33/42 (2013.01) [H01L 21/565 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A template comprising a transferring pattern on a first surface of a substrate,
the transferring pattern including:
a first projecting portion that projects from the first surface with a first height and extends along the first surface;
a second projecting portion that projects from the first surface with a second height higher than the first height and extends along the first surface;
a first columnar portion that is arranged at a position overlapping with the first projecting portion and has a top surface with a third height higher than the second height, the third height being a height from the first surface; and
a second columnar portion that is arranged at a position overlapping with the second projecting portion and has a top surface with the third height,
wherein a first width of the first projecting portion in a first direction along the first surface and intersecting with an extending direction of the first projecting portion is narrower than a second width of the second projecting portion in a second direction along the first surface and intersecting with an extending direction of the second projecting portion.