US 11,806,835 B2
Slurry distribution device for chemical mechanical polishing
Yen-Chu Yang, Santa Clara, CA (US); Stephen Jew, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Haosheng Wu, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); Paul D. Butterfield, San Jose, CA (US); Alexander John Fisher, Santa Clara, CA (US); and Bum Jick Kim, Irvine, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 22, 2021, as Appl. No. 17/209,034.
Application 17/209,034 is a continuation of application No. 15/626,857, filed on Jun. 19, 2017, granted, now 10,967,483.
Claims priority of provisional application 62/510,532, filed on May 24, 2017.
Claims priority of provisional application 62/354,563, filed on Jun. 24, 2016.
Prior Publication US 2021/0205953 A1, Jul. 8, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 57/02 (2006.01); B24B 37/10 (2012.01); H01L 21/67 (2006.01)
CPC B24B 57/02 (2013.01) [B24B 37/10 (2013.01); H01L 21/6708 (2013.01); H01L 21/67075 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for chemical mechanical polishing, comprising:
a rotatable platen having a surface to support a polishing pad;
a carrier head to hold a substrate in contact with the polishing pad; and
a polishing liquid distribution system, the polishing liquid distribution system including
a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad,
a first barrier to block polishing liquid on the polishing surface,
a first actuator to adjust a height of the first barrier relative to the polishing surface and a first pressure of the first barrier on the polishing surface,
a second barrier to block polishing liquid on the polishing surface,
a second actuator to adjust a height of the second barrier relative to the polishing surface and a second pressure of the second barrier on the polishing surface, and
a controller in data communication with the first actuator and the second actuator and operable to select the first pressure of the first barrier on the polishing surface and to select the second pressure of the second barrier on the polishing surface.