US 11,806,834 B2
Apparatus and method for automated mold polishing
Steven John Hauschulz, Chaska, MN (US); and Matthew Knutson, Corcoran, MN (US)
Assigned to PROTOLABS, INC., Maple Plain, MN (US)
Filed by PROTOLABS, INC., Maple Plain, MN (US)
Filed on Oct. 20, 2022, as Appl. No. 17/969,765.
Claims priority of provisional application 63/270,902, filed on Oct. 22, 2021.
Prior Publication US 2023/0127208 A1, Apr. 27, 2023
Int. Cl. B24B 51/00 (2006.01); G05B 19/19 (2006.01)
CPC B24B 51/00 (2013.01) [G05B 19/19 (2013.01); G05B 2219/35012 (2013.01); G05B 2219/35167 (2013.01); G05B 2219/45199 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for automated mold polishing, the apparatus comprising:
at least a processor; and
a memory communicatively connected to the at least a processor, the memory containing instructions configuring the at least a processor to:
receive a finish assignment for at least a surface of a part for manufacture;
input a surface geometry into a polish machine learning model iteratively trained to derive inferences between polishing tool pressures and surface finishes in training data and receive a polish strategy as an output of the polish machine learning model;
select a polishing tool for the at least a surface as a function of the finish assignment and the polish strategy for the at least a surface;
determine a reachable area of the at least a surface as a function of the polishing tool;
generate a toolpath comprising a sequence of grit progressions and movement steps as a function of the reachable area; and
control an automated manufacturing device to execute the toolpath.