| CPC B24B 37/24 (2013.01) [B24B 37/22 (2013.01); B24B 37/26 (2013.01); B24B 37/30 (2013.01)] | 15 Claims |
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1. A polishing pad having a polishing surface that is configured to polish a surface of a substrate, comprising:
a polishing layer, wherein at least a portion of the polishing layer comprises a continuous phase of polishing material comprising:
a plurality of first regions having a first pore-feature density; and
a plurality of second regions having a second pore-feature density that is different from the first pore-feature density, wherein:
the plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a coplanar side-by-side arrangement with the plurality of second regions and the plurality of first regions and the plurality of second regions extend in a Z-direction orthogonal to the X-Y plane,
the second regions are disposed in a staggered arrangement in the Z-direction,
individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions,
the first and second pore-feature densities comprise a cumulative area of a plurality of pore-features as a percentage of total area of the respective first and second regions in the X-Y plane,
the plurality of pore-features comprises openings defined in a surface of the polishing layer, voids that are formed in the polishing material below the surface, pore-forming features comprising a water-soluble-sacrificial material, or combinations thereof,
the X-Y plane is parallel to the polishing surface of the polishing pad, and
the individual portions or ones of the plurality of first regions interposed between the individual portions or ones of the plurality of second regions comprise at least a continuous area defined by a first circle in the X-Y plane having a first radius equal to or greater than about 100 μm.
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