US 11,806,747 B2
Bottom electrode via structures for micromachined ultrasonic transducer devices
Lingyun Miao, Fremont, CA (US); and Jianwei Liu, Fremont, CA (US)
Assigned to BFLY OPERATIONS, INC., Burlington, MA (US)
Filed by BFLY OPERATIONS, INC., Guilford, CT (US)
Filed on Sep. 26, 2022, as Appl. No. 17/953,155.
Application 17/953,155 is a continuation of application No. 16/844,857, filed on Apr. 9, 2020, granted, now 11,484,911.
Claims priority of provisional application 62/833,625, filed on Apr. 12, 2019.
Prior Publication US 2023/0017034 A1, Jan. 19, 2023
Int. Cl. B06B 1/02 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01)
CPC B06B 1/0292 (2013.01) [B81B 3/0021 (2013.01); B81C 1/00158 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0125 (2013.01); B81C 2203/036 (2013.01); B81C 2203/0735 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An ultrasound transducer device, comprising:
an electrode;
a membrane separated from the electrode by a cavity between the membrane and the electrode;
a patterned membrane support layer disposed between the electrode and the membrane, wherein
a pattern of the patterned membrane support layer defines a size and shape of the cavity, and
the patterned membrane support layer comprises an insulating material, and
vias that electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane, wherein
the vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.