US 11,806,743 B2
Spin dispenser module substrate surface protection system
Ching-Hai Yang, Taipei (TW); Yao-Hwan Kao, Baoshan Township (TW); Shang-Sheng Li, Zhubei (TW); Kuo-Pin Chen, Zhubei (TW); Hsiang-Kai Tseng, Zhunan Township (TW); and Chuan-Wei Chen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 27, 2022, as Appl. No. 17/826,561.
Application 15/858,797 is a division of application No. 14/179,337, filed on Feb. 12, 2014, granted, now 9,855,579, issued on Jan. 2, 2018.
Application 17/826,561 is a continuation of application No. 15/858,797, filed on Dec. 29, 2017, granted, now 11,344,910.
Prior Publication US 2022/0288627 A1, Sep. 15, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B05D 1/00 (2006.01); B05C 11/10 (2006.01); B05C 11/08 (2006.01); G03F 7/16 (2006.01); G03F 7/30 (2006.01); H01L 21/67 (2006.01); B05B 11/10 (2023.01)
CPC B05C 11/1039 (2013.01) [B05B 11/1097 (2023.01); B05C 11/08 (2013.01); G03F 7/162 (2013.01); G03F 7/3021 (2013.01); H01L 21/6715 (2013.01); B05D 1/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
placing a wafer onto a rotatable platform disposed inside a cup of a spin coating apparatus, the cup including a basin with sidewalls;
rotating the wafer by the rotatable platform;
while rotating the wafer, dispensing a liquid coating material on an upper surface of the wafer by a liquid dispenser nozzle disposed over the rotatable platform;
activating an ejector device, the ejector device comprising an ejector inlet disposed over the rotatable platform, and a negative pressure source; and
controlling the negative pressure source to remove gaseous or particulate organic material suspended over the wafer by the ejector inlet without disturbing a surface of the liquid coating material.