CPC B05C 11/1039 (2013.01) [B05B 11/1097 (2023.01); B05C 11/08 (2013.01); G03F 7/162 (2013.01); G03F 7/3021 (2013.01); H01L 21/6715 (2013.01); B05D 1/005 (2013.01)] | 20 Claims |
1. A method comprising:
placing a wafer onto a rotatable platform disposed inside a cup of a spin coating apparatus, the cup including a basin with sidewalls;
rotating the wafer by the rotatable platform;
while rotating the wafer, dispensing a liquid coating material on an upper surface of the wafer by a liquid dispenser nozzle disposed over the rotatable platform;
activating an ejector device, the ejector device comprising an ejector inlet disposed over the rotatable platform, and a negative pressure source; and
controlling the negative pressure source to remove gaseous or particulate organic material suspended over the wafer by the ejector inlet without disturbing a surface of the liquid coating material.
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