US 11,806,519 B2
Machining of enclosures for implantable medical devices
Steven T. Deininger, Blaine, MN (US); Michael J. Baade, Zimmerman, MN (US); and Charles E. Peters, Blaine, MN (US)
Assigned to MEDTRONIC, INC., Minneapolis, MN (US)
Filed by MEDTRONIC, INC., Minneapolis, MN (US)
Filed on Nov. 9, 2020, as Appl. No. 17/092,504.
Application 17/092,504 is a continuation of application No. 15/650,665, filed on Jul. 14, 2017, granted, now 10,828,127.
Application 15/650,665 is a continuation of application No. 13/449,446, filed on Apr. 18, 2012, granted, now 10,449,373.
Application 13/449,446 is a continuation of application No. 13/449,428, filed on Apr. 18, 2012, granted, now 10,286,218, issued on May 14, 2019.
Application 13/449,428 is a continuation in part of application No. PCT/US2012/022086, filed on Jan. 20, 2012.
Application 13/449,446 is a continuation in part of application No. PCT/US2012/022071, filed on Jan. 20, 2012.
Application PCT/US2012/022071 is a continuation in part of application No. 12/847,830, filed on Jul. 30, 2010, abandoned.
Claims priority of provisional application 61/436,600, filed on Jan. 26, 2011.
Claims priority of provisional application 61/230,549, filed on Jul. 31, 2009.
Prior Publication US 2021/0121265 A1, Apr. 29, 2021
Int. Cl. A61N 1/375 (2006.01); H01R 43/00 (2006.01); H01R 43/18 (2006.01); H01R 43/20 (2006.01); H05K 5/06 (2006.01); A61N 1/08 (2006.01); A61N 1/18 (2006.01); A61B 90/50 (2016.01)
CPC A61N 1/375 (2013.01) [A61N 1/086 (2017.08); A61N 1/18 (2013.01); A61N 1/3752 (2013.01); A61N 1/3758 (2013.01); H01R 43/005 (2013.01); H01R 43/18 (2013.01); H01R 43/205 (2013.01); H05K 5/06 (2013.01); A61B 90/50 (2016.02); A61N 1/3754 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method of constructing an implantable medical device, comprising:
milling an enclosure sleeve from a material comprising grade 5 titanium, wherein the enclosure sleeve has an open top end and an open bottom end;
after milling at least a portion of the enclosure sleeve, installing at least a portion of circuitry within the at least the portion of the enclosure sleeve; and
coupling a connector block module assembly to at least the portion of the enclosure sleeve, routing electrical pins of a feedthrough block into the connector block module to make electrical contact with lead connections of the connector block module and electrically connecting the lead connections of the connector block module assembly with the circuitry.