US 10,462,945 B2
System for manufacturing assembly board and method for installing undersupporting device of the system
Masayuki Mantani, Yamanashi (JP); and Takaaki Sakaue, Yamanashi (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed on Dec. 9, 2016, as Appl. No. 15/373,909.
Claims priority of application No. 2016-028459 (JP), filed on Feb. 18, 2016; and application No. 2016-028461 (JP), filed on Feb. 18, 2016.
Prior Publication US 2017/0245405 A1, Aug. 24, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 13/00 (2006.01); B25B 11/00 (2006.01); B41F 15/18 (2006.01); B23P 19/04 (2006.01); B41F 15/26 (2006.01); H05K 3/30 (2006.01); H05K 13/04 (2006.01); H05K 3/12 (2006.01)
CPC H05K 13/0069 (2013.01) [B23P 19/04 (2013.01); B25B 11/002 (2013.01); B25B 11/005 (2013.01); B41F 15/18 (2013.01); H05K 3/30 (2013.01); H05K 13/0465 (2013.01); B41F 15/26 (2013.01); B65G 2201/0261 (2013.01); H05K 3/1216 (2013.01); H05K 2203/0165 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A system for manufacturing an assembly board, the system comprising:
an undersupporting device comprising a hollow box with a top board having an upper surface with at least one suction hole therein;
a carrier configured to hold the undersupporting device; a transporter having a pair of conveyors, the transporter configured to transport a board and the undersupporting device;
an undersupporting-device installer provided below the transporter, the undersupporting-device installer having an upper surface with at least one vacuum suction opening that is attachable to and detachable from a bottom surface of the undersupporting device;
a board processor configured to perform a predetermined processing to an upper surface of the board;
a first receiving position and a second receiving position different from the first receiving position, wherein the board is supplied to the first receiving position, and wherein the undersupporting device is supplied to and carried out from the second receiving position;
a working position at which the board processor performs the predetermined processing to the upper surface of the board,
wherein the transporter is configured to deliver the board and the undersupporting device to the working position, wherein the undersupporting device is delivered to the working position by transporting the carrier while the carrier holds the undersupporting device on a lower surface of the carrier
wherein when the board and the undersupporting device are positioned at the working position, the upper surface of the undersupporting device supports a lower surface of the board
the board processor performs the predetermined processing to the upper surface of the board, and the undersupporting device is fixed to the undersupporting-device installer.