US 10,462,932 B2
Memory module cooler with vapor chamber device connected to heat pipes
Travis J. Gaskill, Houston, TX (US)
Assigned to Hewlett Packard Enterprise Development LP, Houston, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US)
Filed on Nov. 1, 2017, as Appl. No. 15/800,695.
Prior Publication US 2019/0131204 A1, May 2, 2019
Int. Cl. H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/20336 (2013.01) [F28D 15/0275 (2013.01); H01L 23/427 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A memory module cooler comprising:
a vapor chamber device with walls that bound a vapor chamber;
a number of heat pipes that include vapor channels, the heat pipes being connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber;
fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber, the fins and the second wall being part of the same continuous body, the fins being outside of the vapor chamber; and
a cold plate cover sealed to the second wall of the vapor chamber device around the fins, wherein the cold plate cover and the second wall of the vapor chamber device bound a liquid coolant chamber.