US 10,462,929 B1
Cooling of a compact electronic device
Ming-Tsung Su, Taipei (TW); Brian Nam, San Jose, CA (US); Shu-Chun Shen, Taipei (TW); Nora Yan, Taipei (TW); Irene Yang, Sunnyvale, CA (US); Richard Chang, Sunnyvale, CA (US); Duc Minh Nguyen, San Jose, CA (US); Jeffrey ChiFai Liew, Millbrae, CA (US); Liem Hieu Dinh Vo, San Jose, CA (US); and William McFarland, Portola Valley, CA (US)
Assigned to Plume Design, Inc., Palo Alto, CA (US)
Filed by Plume Design, Inc., Palo Alto, CA (US)
Filed on Jun. 5, 2018, as Appl. No. 16/224.
Int. Cl. H05K 7/20 (2006.01); H01Q 13/10 (2006.01); H04W 88/08 (2009.01); H05K 5/00 (2006.01)
CPC H05K 7/20145 (2013.01) [H01Q 13/10 (2013.01); H05K 5/0069 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20509 (2013.01); H04W 88/08 (2013.01)] 18 Claims
OG exemplary drawing
1. A Wireless Access Point, comprising:
a housing comprising a plurality of sides each adjacent to a bottom portion, wherein the housing houses a plurality of components comprising a fan module, a Printed Circuit Board (PCB) comprising one or more Wi-Fi radios, and a power supply;
an electrical plug connected to the power supply and extending from the bottom portion for insertion into an electrical outlet for power and for physical support of the Wireless Access Point adjacent to the electrical plug;
vents disposed on the housing on a surface that is recessed from the bottom portion with the electrical plug to provide a gap for air circulation; and
a heatsink supporting the fan module, wherein the fan module is located in an interior of the housing, wherein air intake from the vents is guided between layers of the plurality of components via gaps in edges of the heat sink.