US 10,462,915 B2
Electronic module and method for producing an electronic module having a fluid-tight housing
Uwe Liskow, Asperg (DE)
Assigned to Robert Bosch GmbH, Stuttgart (DE)
Appl. No. 15/779,254
Filed by Robert Bosch GmbH, Stuttgart (DE)
PCT Filed Oct. 19, 2016, PCT No. PCT/EP2016/075035
§ 371(c)(1), (2) Date May 25, 2018,
PCT Pub. No. WO2017/089031, PCT Pub. Date Jun. 1, 2017.
Claims priority of application No. 10 2015 223 550 (DE), filed on Nov. 27, 2015.
Prior Publication US 2018/0352666 A1, Dec. 6, 2018
Int. Cl. H05K 5/00 (2006.01); H05K 5/06 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01)
CPC H05K 5/0082 (2013.01) [H05K 1/144 (2013.01); H05K 3/28 (2013.01); H05K 3/368 (2013.01); H05K 5/0069 (2013.01); H05K 5/06 (2013.01); H05K 5/062 (2013.01); H05K 2201/047 (2013.01)] 20 Claims
OG exemplary drawing
1. An electronic module, comprising
a first circuit board including electronic components;
spacers arranged so as to be resting at least in corner regions of the first circuit board;
a cover plate positioned on the spacers;
a potting compound acting as an end-face closure that seals a gap produced by the spacers between the first circuit board and the cover plate so as to form a housing, wherein:
the electronic components are positioned within the housing;
the potting compound secures the cover plate on the first circuit board in a material-bonding manner; and
a coefficient of linear thermal expansion of the potting compound coincides substantially with a coefficient of linear thermal expansion of the first circuit board and of the cover plate; and
a carrier plate, wherein the first circuit board is positioned at a distance from the carrier plate as a carrier component, with an interspace therebetween, and the potting compound spaces the first circuit board apart from the carrier plate.